News
[November 2024] Congratulations to Fangsheng, whose paper is accepted in IEEE Microwave and Wireless Technology Letters. Paper: Heterogeneous Interface-enhanced Thin-film SAW Devices Using Lithium Niobate on Si. DOI: 10.1109/LMWT.2024.3492723
[October 2024] Congratulations to Jiashuai, whose paper is accepted in the 38th IEEE International Conference on Micro Electron Mechanical Systems (MEMS 2025). See you in Taiwan, Jan. 2025. Paper: SEALED CAVITY BULK ACOUSTIC WAVE RESONATOR WITH COUPLING AND TCF ENHANCEMENT
[October 2024] Congratulations to Fangsheng, whose paper is accepted in the 38th IEEE International Conference on Micro Electron Mechanical Systems (MEMS 2025). See you in Taiwan, Jan. 2025. Paper: DOUBLE-SIDED HEAT DISSIPATION FOR ACOUSTIC RESONATORS BASED ON LITHIUM NIOBATE ON SAPPHIRE
[August 2024] Congratulations to Moustafa Abdelhamid N.M.A. ABDELBAKY, who has been awarded the HKUST RedBird PhD Award for the 2024-25 academic year
[July 2024] Congratulations to Jiashuai and Fangsheng, who have been awarded the HKUST RedBird Academic Excellence Award for Continuing PhD students in the 2023-24 Academic Year
[June 2024] Congratulations to Xingyu, whose paper will be presented in the 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium. See you in Taiwan, September 2024. Paper: Toward Interdigital Transducer-Based mmWave Acoustic: Mitigating Self-Resonances
[June 2024] Congratulations to Junyan, whose paper will be presented in the 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium. See you in Taiwan, September 2024. Paper: Temperature-Driven Degradations on Lithium Niobate MEMS Acoustic Filter
[June 2024] Congratulations to Zijun, whose paper will be presented in the 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium. See you in Taiwan, September 2024. Paper: Experimental Study of the acoustic-Electromagnetic Hybrid Filter at a Wide Temperature Range
[July 2024] Invited talk in RF filter Innovation Technology Conference (第三届射频滤波器创新技术大会)： Ten years of LiNbO3 thin films - from MHz to millimeter wave (铌酸锂薄膜十年-从MHz到毫米波)
Prof. Yang is appointed as the editor of IEEE Transactions on Electron Devices
Prof. Yang is appointed as the Chair of the Microelectromechanical Systems (MEMS) Technical Committee in IEEE EDS
[May 2024] Invited talk in 19th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) in Kyoto, Japan
[Jan. 2024] Invited talk in IEEE Radio & Wireless Week 2024: Surface Acoustic Wave Devices Based on Lithium Niobate and Silicon
[Dec. 2023] Congratulations to Jiashuai XU, whose paper is accepted in the IEEE Journal of Microelectromechanical Systems. Paper: Sealed-cavity Bulk Acoustic Resonator for Subsequent Fabrication and Higher Order Mode
[Dec. 2023] Invited talk in Lithium Niobate Photonics Conference 2023: MEMS Acoustic Waves in Lithium Niobate Thin Films for RF Applications
[Nov. 2023] Congratulations to Junyan ZHENG, whose paper is selected for Oral Presentation at The 37th IEEE International Conference on Micro Electron Mechanical Systems (MEMS 2024). See you in Austin, Jan. 2024. Paper: OVER-1 GHZ BANDWIDTH FILTER BASED ON Y-128° CUT LITHIUM NIOBATE ON AMORPHOUS SILICON
[Oct. 2023] Congratulations to Prof. YANG, who is awarded the 2023 Early Career Award, IEEE Electron Devices Society, which is awarded to one or two researchers worldwide every year for promoting and recognizing leadership and contributions in the research fields of electron devices
[Sep. 2023] Congratulations to Prof. YANG, who is awarded Faculty Teaching Excellence Appreciation Award 2022-23, ECE, HKUST
[Aug. 2023] Congratulations to Xingyu LIU, who is awarded the HKUST RedBird Ph.D. Award
[Jul. 2023] Invited talk in International Symposium of Integrated Circuits: RF-MEMS Devices for Wireless Communications
[Jun. 2023] Invited talk in Bauhinia Seminar 2023 on Power Devices & ICs: RF Filter Chips for Wireless Communications
[Jun. 2023] Congratulations to Tsz Fung HO, who is awarded the 2nd Runner-up in the Best Final Year Project Awards for 2022-23
[Jun. 2023] Congratulations to Huen Ling SO and Yueyan ZHENG, who are awarded the 2nd Runner-up in the Best Final Year Project Awards for 2022-23
[Jun. 2023] Congratulations to Fangsheng QIAN, who is awarded the Best Student Paper Award in the IEEE Student Symposium on Electron Devices and Solid-State Circuits
[Jun. 2023] Congratulations to Junyan ZHENG, who is awarded the Student Paper Award in the IEEE Student Symposium on Electron Devices and Solid-State Circuits
[May 2023] Congratulations to Tsz Fung HO, who is awarded the Solomon System Scholarship 2022-23. Each year, in all HK local universities, only three UG or PG Engineering students can be awarded.
[Apr. 2023] Congratulations to Tsz Fung HO, who is awarded the First Runner-up in the 2023 Undergraduate Research Opportunities Program
[Apr. 2023] Congratulations to Prof. YANG, who is awarded the 2023 UROP Faculty Research Award
[Feb. 2023] Congratulations to Fangsheng QIAN and Tsz Fung HO! Their paper is selected for Oral Presentation at the 2023 IEEE Internation Microwave Symposium (IMS). See you in San Diego this summer! Paper: Twist Piezoelectric Coupling Properties to Suppress Spurious Modes for Lithium Niobate Thin-film Acoustic Devices
[Dec. 2022] Congratulations to Jiashuai XU, Junyan ZHENG, Fangsheng QIAN! Their paper is selected for Oral Presentation at the 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications. Paper: Advancing Lithium Niobate-Based Thin-Film Devices for Next-Generation Wireless Communication
[Nov. 2022] Congratulations to Prof. YANG, who is awarded the IEEE HK Section 50th Anniversary Award
[Aug. 2022] Congratulations to Jiashuai XU, who is awarded the HKUST RedBird Ph.D. Award
[Aug. 2022] Congratulations! Work is published in IEEE Transactions on Microwave Theory and Techniques
[June 2022] Congratulations to Prof. YANG, who is awarded the Microwave Prize from IEEE Microwave Theory and Technology Society (MTT-S)
PI: Yansong Yang
RF Microsystem, MEMS, Resonator, Filter, RF Photonics
Compound (third-generation) semiconductor materials and devices
Email: eeyyang@ust.hk [Google Scholar] [HKUST Personal Website]
Assistant Professor at The Hong Kong University of Science and Technology (HKUST)
Clear Water Bay, Hong Kong SAR
Prospective students and postdoc: feel free to reach out to me!
ABOUT
Ph.D. University of Illinois at Urbana-Champaign (UIUC)
Before joining HKUST, Yansong Yang was a postdoc research associate at University of Illinois at Urbana-Champaign, where he received the M.S. and Ph.D. in electrical engineering in 2017 and 2019. He has won 2nd Place in Best Paper Competition at the 2018 IEEE International Microwave Symposium, and the best paper award at the 2019 IEEE International Ultrasonics Symposium. He was also a finalist for the Advanced Practices Paper Competition Award at the 2020 IEEE International Microwave Symposium and the Best Paper Award at the 2018 IEEE International Frequency Control Symposium. He is also a recipient of the 2019 P. D. Coleman Graduate Research Award from the Department of Electrical and Computer Engineering at UIUC. He also received the 2022 Microwave Prize from the IEEE Microwave Theory & Technology Society. He is awarded the 2023 Early Career Award from the IEEE Electron Devices Society.
His works have been awarded Best Paper Awards 6 times and Best Paper finalists 2 times in top-tier international conferences. His publications have been awarded as "JMEMS RightNow Papers" of IEEE Journal of Microelectromechanical Systems. He has more than 20 patents granted or pending in the U.S. and China, and his published works have been adopted in dozens of patents of RF companies.
His lab focuses on developing multi-physics (including electrical, mechanical, and optical domains) hybrid microsystems for signal processing, sensing, and computing on a single chip. The related work includes the design and nano-microfabrication techniques of novel RF MEMS platforms (resonators, filters, delay lines, switches, etc.) and photonic integrated circuits for higher operating frequencies and efficiency.